Good news: the CC26XX module hasOne big and one smallTwo packaging options
![](http://ae01.alicdn.com/kf/HTB1DYgabjfguuRjy1zeq6z0KFXaz.jpg)
Module data download connection (copy to browser open): http://bbs.iotxx.com/thread-1-1-1.html
II. Based on the module, LaunchIOT development board data download connection reference.
Module data preview
![](http://ae01.alicdn.com/kf/HTB1r_WnIrGYBuNjy0Foq6AiBFXan.jpg)
CC2640 is the second generation of TI (American TI) Bluetooth chip. Compared to the first generation of CC2541/40, the promotion is not only the performance, but also the invincible Simplelink architecture. The Simplelink architecture covers BLE, ZigBee, WiFi and IEEE802.15.4 low power wireless technology. Simplelink uses the same development environment, unified API driver function, code 100% reuse. In addition, using real-time operating system TI-RTOS, developers only need to focus on application logic, without paying attention to the bottom layer.
![](http://ae01.alicdn.com/kf/HTB1n6GAIruWBuNjSszgq6z8jVXaM.jpg)
The Simplelink platform module of the Internet of things design has the following models. The modules are packaged and the pins are the same, and they can be replaced each other. The model parameters of each module are as follows: CC2630 supports the ZigBee and RF4CE protocols, CC2640R2 uses the latest Bluetooth5.0 technology, CC2650 is a multi protocol chip, and one chip makes ZigBee, BLE, RF4CE and many other protocols.
At present, CC2640MOD, CC2640R2MOD and CC2650MOD are available in stock and can be purchased directly. CC2630MOD needs to order.
![](http://ae01.alicdn.com/kf/HTB1E4abIv9TBuNjy0Fcq6zeiFXaf.jpg)
RSM package module uses 4x4 chip package (RF front end is: InternalBias internal bias +DifferentOutput differential output), miniaturized design, developers can be great, only unexpected, not do not!
![](http://ae01.alicdn.com/kf/HTB1ogBgIwaTBuNjSszfq6xgfpXa1.jpg)
The module is encapsulated by stamp hole patch and can be manufactured on machine patch. The module encapsulated by RGZ is only 18.2*26.6mm, with a thickness of 2.8mm, and an anti jamming shield is designed. The size of the RSM module is only 11*16mm, and the thickness is 2.3mm.
![](http://ae01.alicdn.com/kf/HTB166hvIv5TBuNjSspcq6znGFXa5.jpg)
![](http://ae01.alicdn.com/kf/HTB1i9oBz5CYBuNkSnaVq6AMsVXaH.jpg)
In the design of the module, each material is strictly screened to ensure that it meets the industrial standard, so that it can work stably in the range of - 40 ~ + 85 & deg.
![](http://ae01.alicdn.com/kf/HTB1LIqCIpOWBuNjy0Fiq6xFxVXaK.jpg)
The module also designed a resource rich LaunchIOT IOT development kit for beginners.
![](http://ae01.alicdn.com/kf/HTB1UN46IuOSBuNjy0Fdq6zDnVXam.jpg)
![](http://ae01.alicdn.com/kf/HTB1wdyXIpuWBuNjSszbq6AS7FXaf.jpg)
LaunchIOT development board material free download, download address (copy to browser open): http://bbs.iotxx.com/thread-6-1-1.html
In addition, module matching board / small board PCB board, can quickly verify the module, and can directly connect our XDS110 emulator, realize the first step of agile development! Click the picture to enter the connection / purchase connection of the small system.
![](http://ae01.alicdn.com/kf/HTB1LZyCIpOWBuNjy0Fiq6xFxVXae.jpg)
CC26X0MOD-RSM module X 1, antistatic bag packing
\`